NDLI: Lead Free Flip Chip Reliability for Various Package Types

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Islam, Nokibul Jimarez, Miguel Syed, Ahmer Hwang, Taekyeong Gim, Jaeyun Kang, Wonjoon
Copyright Year	2011
Abstract	Flip Chip (FC) technology has now become the mainstream solution for high performance packages. From commercial gaming machines to high reliability servers, the FC package is gaining more market share over traditional packaging technologies, such as wire bond. Extensive research has been carried out to make the flip chip more robust, smaller foot prints, and excellent performance. FC packages are fabricated typically in two main configurations. Bare die FC packages leave the non active side of the die exposed. This allows the customer to apply their preferred heat dissipation scheme during board level attach. Lidded FC packages use a metallic lid attached to the die. Bare die package can be further subdivided into bare die underfilled package and bare die flip chip molded ball grid array (FCmBGA) package. Each of these packaging configurations has advantages as well as disadvantages. FCmBGA uses molding compound or EMC instead of capillary underfill, to protect FC die, and eliminate the need for a lid. Package warpage reduced a lot by adding a lid with the bare die FC package. However, the package and board level reliability for the above package types are still debatable. In this study test vehicles with three package types with bumps and BGAs are daisy chain to measure in situ data during accelerated tests. Impact of standard vs. low CTE (coefficient of thermal expansion) core substrate, accelerated temperature cycle conditions (temperature cycle condition “B”, “H”, and “J” according to JEDEC), and package level vs. package mounted on the board level reliability will be investigated. Comprehensive reliability data will help to select the right package type for next generation large die large body flip chip application.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	609
Ending Page	615
Page Count	7
File Format	PDF
ISBN	9780791844618
DOI	10.1115/IPACK2011-52260
Volume Number	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
Conference Proceedings	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
Language	English
Publisher Date	2011-07-06
Publisher Place	Portland, Oregon, USA
Access Restriction	Subscribed
Subject Keyword	Underfill Eol Tc-b Warpage Lead free Tc-j Flip chip Tc-h Spl Mrt Fcmbga Reliability Delamination Flip-chip devices Ball-grid-array packaging Warping Flip-chip
Content Type	Text
Resource Type	Article

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