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| Content Provider | The American Society of Mechanical Engineers (ASME) Digital Collection |
|---|---|
| Author | Papadopoulos, George Tiliakos, Nicholas Benel, Gabriel |
| Copyright Year | 2011 |
| Abstract | The design, fabrication and preliminary performance of a variable density pin array micro heat exchanger for micro-cooling applications is reported. Various pin diameters and density configurations were analyzed for their ability to provide maximum uniform heat transfer over the active area of the micro-heat exchanger using air as the working fluid for maximum mass flow rates through the micro-heat exchanger in the range of 40 mg/sec to 60 mg/sec. Fabrication of the micro-heat exchanger was performed using deep reactive ion etching (DRIE) technique on a 0.5 mm thick silicon wafer with nominal feature sizes in the range of 5 microns to 20 microns. Performance data is presented based on analysis and comparison to a baseline configuration with no pins. |
| Starting Page | 1037 |
| Ending Page | 1044 |
| Page Count | 8 |
| File Format | |
| ISBN | 9780791854921 |
| DOI | 10.1115/IMECE2011-62888 |
| Volume Number | Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B |
| Conference Proceedings | ASME 2011 International Mechanical Engineering Congress and Exposition |
| Language | English |
| Publisher Date | 2011-11-11 |
| Publisher Place | Denver, Colorado, USA |
| Access Restriction | Subscribed |
| Subject Keyword | Reactive-ion etching Cooling Pins (engineering) Semiconductor wafers Heat exchangers Density Flow (dynamics) Performance characterization Design Heat Fluids Manufacturing Heat transfer |
| Content Type | Text |
| Resource Type | Article |
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