NDLI: Evaluation of a Stacked Package Utilizing LGA Devices

Please wait, while we are loading the content...

ANES/ASME Joint National Solar Energy Week

ASME Citrus Engineering Symposium

ASME India Oil and Gas Pipeline Conference

ASME International Mechanical Engineering Congress and Exposition

ASME 2002 International Mechanical Engineering Congress and Exposition(IMECE2002)

ASME 2003 International Mechanical Engineering Congress and Exposition(IMECE2003)

ASME 2004 International Mechanical Engineering Congress and Exposition(IMECE2004)

ASME 2005 International Mechanical Engineering Congress and Exposition(IMECE2005)

ASME 2006 International Mechanical Engineering Congress and Exposition(IMECE2006)

ASME 2007 International Mechanical Engineering Congress and Exposition(IMECE2007)

ASME 2008 International Mechanical Engineering Congress and Exposition(IMECE2008)

ASME 2009 International Mechanical Engineering Congress and Exposition(IMECE2009)

ASME 2010 International Mechanical Engineering Congress and Exposition(IMECE2010)

Volume 12: Processing and Engineering Applications of Novel Materials

Volume 4: Electronics and Photonics

Characteristic Analysis of Anti-Reflective Subwavelength Cross Gratings Fabricated With Holographic Technique

Isothermalization of an IGBT Power Electronic Chip

An Evaluation of a Modified Iosipescu Specimen for Measurement of Elastic-Plastic Properties of Solder Materials

Conjugate Mixed Convection With Surface Radiation and Substrate Conduction in Laminar Channel Flow With Discrete Flush-Mounted Heat Sources

Experimental Model Identification and Controller Design of a Vapor Compression Cycle for Electronics Cooling

Electronics Packaging to Isolate MEMS Sensors From Thermal Transients

Thermal Management for High Power Light-Emitting Diode Street Lamp

Heat Transfer Performance of Superhydrophilic Nanostructured Cu Micropost Wicks for Micro Heat Pipes

Performance Modeling of Micropost Wicks for Micro Heat Pipes at Low Heat Fluxes

State-of-the-Art and Trends in Through-Silicon Via (TSV) and 3D Integrations

Copper to Copper Direct Bonding Assisted by Self-Assembled Monolayer

Spiking and Humping Defects in Laser Welding

The Investigation of 3D Embedded Microchannel Networks for 3D IC Cooling, Vacuum Packaging and THz Passive Device Applications

Comparison of Enabling Wafer Bonding Techniques for TSV Integration

Interfacial Delamination Between Through Silicon Vias (TSVs) and Silicon Matrix

Reliability Assessment of 3D Chip Stacking Package Using Metal Bonding and Through Silicon Via Technologies

Power Stack Die Package Design, Simulation and Reliability Analysis

Embedded 3D Hybrid IC Integration System-in-Package (SiP) for Opto-Electronic Interconnects in Organic Substrates

Thermal-Enhanced and Cost-Effective 3D IC Integration With TSV (Through-Silicon Via) Interposers for High-Performance Applications

Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment

Heat Transfer Enhancement by Helium Gas Filled in a Hard Disk Drive Enclosure

Recent Advancement on Liquid Metal Cooling for Thermal Management of Computer Chip

Hot Spot Mitigating With Oblique Finned Microchannel Heat Sink

Heat Transfer Analysis of the High-Power LED Lamp With Liquid-Cooled Package

Thermoelectric Coolers for Thermal Gradient Management on Chip

Multiscale Thermal Transport Across Solid-Solid Interfaces

Ballistic Heat Transfer Modelling in Semiconductor Electronic Devices: A Modified Fourier-Based Approach

Experimental Model Identification and Controller Design of a Vapor Compression Cycle for Electronics Cooling

Lifecycle-Based Data Center Design

Conjugate Mixed Convection With Surface Radiation and Substrate Conduction in Laminar Channel Flow With Discrete Flush-Mounted Heat Sources

Design, Modeling, and Optimization for Highly Efficient Ionic Wind-Based Cooling Microfabricated Devices

Fast Prediction of Temperature Evolution in Electronic Devices for Run-Time Thermal Management Applications

Development of Thermal Interface Materials for Harsh Environment Packaging of Superconducting Integrated Circuits

Sub-Atmospheric Pressure Pool Boiling of Water on a Screen Laminate-Enhanced, Wavy-Fin Array

Polarization Measurements of Molded Liquid Crystal Polymer/Titania Composites

Organic Monolayers for Low Temperature Copper – Gold Bonding

Stabilization Effect of Surfactant and Functional Group on Highly Concentrated Carbon Nanotube Conductive Ink

Prognostic Health Monitoring of Damage Progression in Leadfree Electronics Under Sequential Exposure to Thermal Aging and Thermal Cycling

Evaluation of a Stacked Package Utilizing LGA Devices

A Viscoplasticity Model for Solder Alloys

Effects of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronics Assembly

Modeling of Two-Phase Micro-Channel Flow for Thermal Management of Electronic Systems

Analysis and Characterization of Surface Plasmon Enhancement of Light Absorption in Organic Solar Cells by the Transfer Matrix Method

Heat Conduction in a Rectangular Tube With Eccentric Hot Spots

An Evaluation of a Modified Iosipescu Specimen for Measurement of Elastic-Plastic Properties of Solder Materials

A Numerical Methodology for Thermo-Mechanical Characterization of High Power Electronic Packages

Conjugate Effect of Hygro and Thermo-Mechanical Behavior in MEMS Packages

Thermal and Structural Response of Pin Fins for Different Interface Conditions

Thermal-Aware Power Migration in Many-Core Processors

Three-Dimensional Multiphysics Analyses of a CPU Integrated Thermal Heat Sink

Rear Door Heat Exchanger Cooling Performance in Telecommunication Data Centers

Effect of Thermal Characteristics of Electronic Enclosures on Dynamic Data Center Performance

Thermally Based Design Optimization of Telecommunication Shelter

Topological Design Optimization of Nested Channels for Squeeze Flow of Thermal Interface Materials

Nanostructure Dependence of the Electronic Conductivity of Carbon Nanotubes and Graphene Sheets

Fatigue Strength of Ribbon Bonds

Micro Texture Dependence of Both the Mechanical and Electrical Properties of Electroplated Copper Thin Films Used for Interconnection

A Reliability Study of a Novel Type of Solder-Less Interconnection

Health Monitoring Method for Load Assessment and Cooling Performance Degradation of Printed Circuit Boards

Parallel-Path Compliant Structures as Electrical Interconnects

Voiding and Thermal Resistance Modeling and Characterization for a QFN Assembly

Reliable Design of Electroplated Copper Through Silicon Vias

Laser Ultrasonic Inspection of Solder Bumps in Flip Chip Packages Using Virtual Package Device as Reference

Failure-Mode Clustering for Electronics Under Shock and Vibration Using Neural-Net Based Self-Organized Maps

Tape Peel Testing as a Simple Method to Evaluate Interfacial Adhesion of Sputtered Thin Layers of Various Metals

Lessons Learned From Avionics Integrity Program (AVIP) Durability Life Testing (DLT)

Volume 8: Dynamic Systems and Control, Parts A and B

Volume 6: Engineering Education and Professional Development

Volume 7: Fluid Flow, Heat Transfer and Thermal Systems, Parts A and B

Volume 5: Energy Systems Analysis, Thermodynamics and Sustainability; NanoEngineering for Energy; Engineering to Address Climate Change, Parts A and B

Volume 10: Micro and Nano Systems

Volume 13: Sound, Vibration and Design

Volume 1: Advances in Aerospace Technology

Volume 9: Mechanics of Solids, Structures and Fluids

Volume 11: New Developments in Simulation Methods and Software for Engineering Applications; Safety Engineering, Risk Analysis and Reliability Methods; Transportation Systems

Volume 3: Design and Manufacturing, Parts A and B

Volume 2: Biomedical and Biotechnology Engineering

ASME 2011 International Mechanical Engineering Congress and Exposition(IMECE2011)

ASME 2012 International Mechanical Engineering Congress and Exposition(IMECE2012)

ASME 2013 International Mechanical Engineering Congress and Exposition(IMECE2013)

ASME 2014 International Mechanical Engineering Congress and Exposition(IMECE2014)

ASME 2015 International Mechanical Engineering Congress and Exposition(IMECE2015)

ASME 2016 International Mechanical Engineering Congress and Exposition(IMECE2016)

ASME 2017 International Mechanical Engineering Congress and Exposition(IMECE2017)

ASME 2018 International Mechanical Engineering Congress and Exposition(IMECE2018)

ASME International Pipeline Geotechnical Conference

ASME Power Conference

ASME Turbine Blade Tip Symposium

ASME/IEEE Joint Rail Conference

ASME/JSME Thermal Engineering Joint Conference

ASME/NRC Pump and Valve Symposium

ASME/USCG Workshop on Marine Technology and Standards

CANEUS: MNT for Aerospace Applications

Dynamic Systems and Control Conference

Energy Nanotechnology International Conference

Energy Sustainability

Engineering Systems Design and Analysis

Engineering Technology Conference on Energy

Fluid Power Systems Technology

Fluids Engineering Division Summer Meeting

Frontiers in Biomedical Devices

Gas Turbine India Conference

Global Congress on NanoEngineering for Medicine and Biology

Heat Transfer Summer Conference

High Temperature Reactor Technology

Information Storage and Processing Systems

Integrated Nanosystems: Design, Synthesis, and Applications

Internal Combustion Engine Division Fall Technical Conference

Internal Combustion Engine Division Spring Technical Conference

International Conference on Fluidized Bed Combustion

International Conference on Fuel Cell Science, Engineering and Technology

International Conference on Integration and Commercialization of Micro and Nanosystems

International Conference on Micro/Nanoscale Heat Transfer

International Conference on Nanochannels, Microchannels, and Minichannels

International Conference on Nuclear Engineering

International Conference on Offshore Mechanics and Arctic Engineering

International Conference on Radioactive Waste Management and Environmental Remediation

International Design Engineering Technical Conferences and Computers and Information in Engineering Conference

International Electronic Packaging Technical Conference and Exhibition

International Heat Transfer Conference

International Joint Power Generation Conference

International Joint Tribology Conference

International Manufacturing Science and Engineering Conference

International Pipeline Conference

International Solar Energy Conference

International Symposium on Flexible Automation

Multifunctional Nanocomposites and Nanomaterials International Conference

Noise Control and Acoustics Division Conference

North American Waste-to-Energy Conference

Pressure Technology

Pressure Vessels and Piping Conference

Rail Transportation Division Conference

Small Modular Reactors Symposium

Smart Materials, Adaptive Structures and Intelligent Systems

Summer Bioengineering Conference

Turbo Expo: Power for Land, Sea, and Air

Verification and Validation

Water Quality, Drought, Human Health and Engineering Conference

Wind Energy Symposium

World Conference on Innovative Virtual Reality

World Tribology Congress

Evaluation of a Stacked Package Utilizing LGA Devices

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Srinivasan, G. Iyer, S. Havens, R. Srihari, K.
Copyright Year	2010
Abstract	A Land Grid Array (LGA) is an area array component similar to a Ball Grid Array (BGA), but without solder balls attached to the bottom surface of the package. Due to the absence of solder balls, the LGA package has a lower thickness as compared to an equivalent BGA package. Accordingly, this reduces the thickness of the module assembly. This is a critical consideration especially for modules using stacked packages. On the other hand, the lower standoff height of the solder joints could have an impact on the performance of the package during temperature cycling. For high density modules, along with ‘minimizing’ the thickness, it is desirable to avoid increasing the package size in the length and width directions. This allows maintaining the same number of Inputs/Outputs (I/Os) as a comparable BGA device and accommodates the package on existing Printed Circuit Board (PCB) designs. For this reason, the LGA package used for the current research was identical to the BGA device that is currently used for the stacked package, but without solder balls on the bottom side. The stacked package utilizing these LGA devices and the modules were assembled using Sn3.8Ag0.7Cu lead-free solder. The reliability of the assembly was assessed using thermal cycling test. Based on the results, the first failure was recorded at the end of 1250 thermal cycles, whereas the comparable stacked package using BGA components was able to withstand 1500 cycles without failures. Dye & pry analysis was also performed on the failed stacked packages as a part of failure analysis.
Starting Page	303
Ending Page	308
Page Count	6
File Format	PDF
ISBN	9780791844281
DOI	10.1115/IMECE2010-40899
Volume Number	Volume 4: Electronics and Photonics
Conference Proceedings	ASME 2010 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2010-11-12
Publisher Place	Vancouver, British Columbia, Canada
Access Restriction	Subscribed
Subject Keyword	Cycles Solder joints Solders Temperature Density Lead-free solders Ball-grid-array packages Printed circuit boards Ball-grid-array packaging Failure analysis Manufacturing Reliability Failure
Content Type	Text
Resource Type	Article

Central Library (ISO-9001:2015 Certified)
Indian Institute of Technology Kharagpur
Kharagpur, West Bengal, India | PIN - 721302

See location in the Map
03222 282435
Mail: support@ndl.gov.in

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in