NDLI: The Network Locating Principle in Flexible Circuit Board Assembly

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Chen, Ruijun
Copyright Year	2009
Abstract	This paper focuses on developing the Network Locating Principle for fixturing tooling design in flexible circuit board assembly. From a viewpoint of Thermodynamics, a flexible circuit board populated with electronic components on the first side is a closed thermodynamic system. It experiences deformation energy change, assembly load work, and heat transfer during an isothermal assembly process on the second side, such as solder paste deposit printing and electronic component placement processes. Based on the First and Second Laws of Thermodynamics and Energy Equation of Thermoelastic Theory, a fixturing analysis is developed to investigate the deformation energy change, and furthermore the theoretical fixturing solution is derived to minimize the assembly load work during the isothermal assembly processes. To this end, the Network Locating Principle is proposed to guide fixturing tooling design for the isothermal assembly processes on the second side. Effectiveness of the Network Locating Principle is verified in numerical and experimental studies of flip chip placement processes on a thin flexible circuit.
Starting Page	131
Ending Page	136
Page Count	6
File Format	PDF
ISBN	9780791843789
DOI	10.1115/IMECE2009-10305
e-ISBN	9780791838631
Volume Number	Volume 5: Electronics and Photonics
Conference Proceedings	ASME 2009 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2009-11-13
Publisher Place	Lake Buena Vista, Florida, USA
Access Restriction	Subscribed
Subject Keyword	Printing Solders Deformation Circuits Electronic components Flip-chip Laws of thermodynamics Thermal systems Stress Tooling Design Thermodynamics Printed circuit boards Fixturing Thermoelasticity Manufacturing Flip-chip devices Heat transfer
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in