NDLI: Seamless Tool Integration for Solder Joint Qualifications

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Qian, Zhengfang Wu, Xin
Copyright Year	2008
Abstract	This paper presents an approach and its demonstration for seamless tool integration for the virtual qualification and reliability prediction of solder joints of surface mounted electronic components on a populated circuit board. Starting from software called Surface Evolver, it can be used to realistically reproduce complicated geometry profiles of solder joints with various lead frames and pad specifications. User routines have been developed under ANSYS platform for automatic geometry transfer from the Surface Evolver and mesh regeneration of the solder joints inside ANSYS, as demonstrated in this paper. Moreover, a number of electronic packages with their solder joints on a typical printed circuit board (PCB) were also regenerated with parametric capability. Finite element analyses (FEAs) with proper set-up of materials, boundary conditions, and constitutive models were performed automatically by hitting one-button to go. Reliability prediction of solder joints and the failure rate of electronic components can be predicted based on failure criteria and test data implemented. An in-house tool was developed for the whole procedure of solder joint qualification and reliability assessment from deterministic to statistical aspects, including the evaluation of defect impacts.
Starting Page	187
Ending Page	193
Page Count	7
File Format	PDF
ISBN	9780791848739
DOI	10.1115/IMECE2008-66449
e-ISBN	9780791838402
Volume Number	Volume 12: Mechanics of Solids, Structures and Fluids
Conference Proceedings	ASME 2008 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2008-10-31
Publisher Place	Boston, Massachusetts, USA
Access Restriction	Subscribed
Subject Keyword	Geometry Solder joints Printed circuit boards Computer software Electronic components Boundary-value problems Finite element analysis Reliability Electronic packages Failure Constitutive equations
Content Type	Text
Resource Type	Article

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