NDLI: Constitutive Relations of High Temperature Solders

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Schoeller, Harry Bansal, Shubhra Knobloch, Aaron Shaddock, David Cho, Junghyun
Copyright Year	2007
Abstract	This study focuses on microelectronic package design for the oil and natural gas drilling of wells with depths in excess of 20,000 ft, where package temperatures can exceed 204°C. At these high temperatures, solder interconnect sites are subject to fatigue and creep failures due to the stress generated by the thermal expansion mismatch between various components in the package. Typically this phenomenon is modeled by finite element analysis (FEA) to predict the number of cycles to failure. To ensure meaningful model results, however, accurate time and temperature-dependent mechanical properties are needed. This study examines five solders suitable for high temperature: 90Pb-10Sn, 95Sn-5Sb, 92.5Pb-5Sn-2.5Ag, 95Pb-5In, and 93Pb-3Sn-2Ag-2In. Uniaxial tension tests of the solder wires are carried out on a MTS servohydraulic machine using wedge grips. To evaluate the time-dependence on deformation, a strain rate study was carried out at 0.5%/sec, 1%/sec, and 5%/sec. Nanoindentation of solder wire is performed and compared to the corresponding solder wires tested through uniaxial tension tests. Dynamic nanoindentation through continuous stiffness measurement is performed on the wires to obtain the indentation data less sensitive to creep of the material, as well as to assess the effect of indentation depth on elastic modulus for each solder. One purpose of nanoindentation testing is to determine its suitability for the mechanical testing of soft solders. Mechanical properties obtained from these tests will be used in future modeling studies to estimate the cyclic fatigue life of these solders under thermal loading.
Starting Page	201
Ending Page	208
Page Count	8
File Format	PDF
ISBN	0791842991
DOI	10.1115/IMECE2007-42215
e-ISBN	0791838129
Volume Number	Volume 5: Electronics and Photonics
Conference Proceedings	ASME 2007 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2007-11-11
Publisher Place	Seattle, Washington, USA
Access Restriction	Subscribed
Subject Keyword	Cycles Solders Temperature Deformation Creep High temperature Wire Machinery Modeling Design Tension Mechanical testing Stiffness Failure Testing Drilling Elastic moduli Fatigue life Nanoindentation Mechanical properties Fatigue Wedges Stress Thermal expansion Finite element analysis Wells Constitutive equations Natural gas
Content Type	Text
Resource Type	Article

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