NDLI: Energy Flow in the Information Technology Stack: Introducing the Coefficient of Performance of the Ensemble

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Chandrakant, D. Patel Ratnesh, K. Sharma Cullen, E. Bash Monem, H. Beitelmal
Copyright Year	2006
Abstract	The information technology industry is in the midst of a transformation to lower the cost of operation through consolidation and better utilization of critical data center resources. Successful consolidation necessitates increasing utilization of capital intensive "always-on" data center infrastructure, and reducing the recurring cost of power. A need exists, therefore for an end to end physical model that can be used to design and manage dense data centers and determine the cost of operating a data center. The chip core to the cooling tower model must capture the power levels and thermo-fluids behavior of chips, systems, aggregation of systems in racks, rows of racks, room flow distribution, air conditioning equipment, hydronics, vapor compression systems, pumps and heat exchangers. Earlier work has outlined the foundation for creation of a "smart" data center through use of flexible cooling resources and a distributed sensing and control system that can provision the cooling resources based on the need. This paper shows a common thermodynamic platform which serves as an evaluation and basis for policy based control engine for such a "smart" data center with much broader reach - from chip core to the cooling tower. Computational Fluid Dynamics modeling is performed to determine the computer room air conditioning utilization for a given distribution of heat load and cooling resources in a production data center. Coefficient of performance (COP) of the computer room air conditioning units, based on the level of utilization, is used with COP of other cooling resources in the stack to determine the COP of the ensemble. The ensemble COP represents an overall measure of the performance of the heat removal stack in a data center.
Sponsorship	Heat Transfer Division
Starting Page	233
Ending Page	241
Page Count	9
File Format	PDF
ISBN	0791847861
DOI	10.1115/IMECE2006-14830
e-ISBN	0791837904
Volume Number	Heat Transfer, Volume 3
Conference Proceedings	ASME 2006 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2006-11-05
Publisher Place	Chicago, Illinois, USA
Access Restriction	Subscribed
Subject Keyword	Data center management Control Energy Smart data center Sustainability Data center Energy efficiency Chip System Air conditioning Computers Compression Cooling Computational fluid dynamics Hydronic heating Vapors Control systems Heat exchangers Flow (dynamics) Modeling Engines Stress Design Data centers Heat Pumps Cooling towers Thermofluids
Content Type	Text
Resource Type	Article

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