NDLI: Low-Temperature Sintering of Nanoscale Silver Pastes for High-Performance and Highly-Reliable Device Interconnection

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	John, G. Bai Zach, Z. Zhang Jesus, N. Calata Lu, Guo-Quan
Copyright Year	2005
Abstract	In this paper, we report our development on making of nanoscale silver pastes and their low-temperature sintering for semiconductor device interconnections. The nanoscale silver pastes were prepared by dispersing 30-nm silver powder under ultrasonic vibration and mechanical agitation in an organic vehicle. Sintering of the silver paste prints at 280°C for 10 minutes resulted in a density of ~80% in the air ambient. Some important properties of the low-temperature sintered silver include ~2.4 W/K-cm for thermal conductivity, ~3.8 × 10−6 Ω-cm for electrical resistivity, and ~9 GPa for the effective elastic modulus. SiC Schottky rectifiers attached to either silver- or gold-coated direct bond copper (DBC) substrates show low forward voltage drops. The silver joints do not contain large voids but rather uniformly distributed microscale pores. Die-shear tests showed that bonding strengths of the silver joints were around 21 MPa on the gold-coated DBC substrates and 38 MPa on the silver-coated DBC substrates, respectively. The latter is comparable to that of reflowed eutectic lead-tin solder joints. Based on the findings in this work, the low-temperature sintering of nanoscale silver pastes is promising to be a high performance and highly-reliable semiconductor device bonding solution for high power packages.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	415
Ending Page	424
Page Count	10
File Format	PDF
ISBN	0791842177
DOI	10.1115/IMECE2005-79187
e-ISBN	0791837696
Volume Number	Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
Conference Proceedings	ASME 2005 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2005-11-05
Publisher Place	Orlando, Florida, USA
Access Restriction	Subscribed
Subject Keyword	Power device interconnection Nanoscale silver pastes Reliability Silver joints High-temperature packaging Low-temperature sintering Nanoscale phenomena Silver Sintering Low temperature
Content Type	Text
Resource Type	Article

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