NDLI: A Study on the Effect of Inclination on Thermal Behaviors of Natural Convection Inside Thin Electronic Equipment Casing

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Ishizuka, Masaru Kitamura, Yoji
Copyright Year	2003
Abstract	With rapid increase of the power dissipation density in modern electronic equipment, the cooling design of electronic equipment becomes increasingly important. For widely used forced-convection air-cooled systems, the reliability of and the acoustic noise of the fan present serious concerns as the air velocity is increased to enhance the cooling capacity. Thus, the interest in natural convection air-cooling is growing to take advantages of low noise and energy saving inherent in that cooling mode. One method of promoting the capacity of natural air-cooling is to incline the electronics casing, thereby, induce draft air by what is called the chimney effect. However, the effect of inclination on the thermal behavior and the cooling capacity has not yet been fully understood due to the involvement of many parameters in driving the draft air. This paper presents the results of experimental and numerical studies on the effect of casing inclination on the temperature rise across the casing. The numerical simulation was carried out to find the thermal behavior inside a thin electronic casing. The simulation results are in good agreement with the experimental data. A thermal design guide is obtained regarding how the cooling effect is improved by increasing the inclination angle.
Sponsorship	Heat Transfer Division
Starting Page	271
Ending Page	277
Page Count	7
File Format	PDF
ISBN	0791837181
DOI	10.1115/IMECE2003-42406
Volume Number	Heat Transfer, Volume 2
Conference Proceedings	ASME 2003 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2003-11-15
Publisher Place	Washington, DC, USA
Access Restriction	Subscribed
Subject Keyword	Electronic equipment Forced convection Temperature Cooling Computer simulation Electronics Natural convection Acoustics Density Design Noise (sound) Simulation results Energy dissipation Reliability
Content Type	Text
Resource Type	Article

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