NDLI: Reliability Evaluation of CSP Using New Flip-Chip Bonding Technology: Both-Sided CSP and Single-Sided CSP

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Koguchi, Hideo Taweejun, Nipon Nishida, Kazuto Sasaki, Chie
Copyright Year	2002
Abstract	Chip-size packaging (CSP) attracts largely attentions due to its lighter, thinner and smaller size. In this study, the deformations and the stresses in the CSP fabricated by non-conductive film stud-bump direct interconnection (NSD) were analyzed. The reliability evaluation of single-sided CSP and both-sided CSP were investigated for heat cycles. The material parameters, i.e. stresses, strains and deformations, for achieving a high reliability of CSP were investigated using a finite element method and experiment. The dependency of the life in single-sided CSP and both-sided CSP on the thicknesses of IC and substrate could be expressed using a normal stress in the thickness direction and shear stress in the vertical cross section, respectively.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	379
Ending Page	385
Page Count	7
File Format	PDF
ISBN	0791836487
DOI	10.1115/IMECE2002-39682
Volume Number	Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
Conference Proceedings	ASME 2002 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2002-11-17
Publisher Place	New Orleans, Louisiana, USA
Access Restriction	Subscribed
Subject Keyword	Finite element method Stud bump Chip-size package Resin encapsulation Flip chip Deformation Flip-chip Packaging Shear stress Thermodynamic cycles Finite element methods Reliability Resins Bonding Stress Diluents
Content Type	Text
Resource Type	Article

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