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| Content Provider | The American Society of Mechanical Engineers (ASME) Digital Collection |
|---|---|
| Author | Mitchell, P. Hoesing Gregory, J. Michna |
| Copyright Year | 2014 |
| Abstract | The ongoing development of faster and smaller electronic components has led to a need for new technologies to effectively dissipate waste thermal energy. The pulsating heat pipe (PHP) shows potential to meet this need, due to its high heat flux capacity, simplicity, and low cost. A 20-turn flat plate PHP was integrated into an aluminum flat plate heat sink with a simulated electronic load. The PHP heat sink used water as the working fluid and had 20 parallel channels with dimensions 2 mm × 2 mm × 119 mm. Experiments were run under various operating conditions, and thermal resistance of the PHP was calculated. The performance enhancement provided by the PHP was assessed by comparing the thermal resistance of the heat sink with no working fluid to that of it charged with water. Uncharged, the PHP was found to have a resistance of 1.97 K/W. Charged to a fill ratio of approximately 75% and oriented vertically, the PHP achieved a resistance of .49 K/W and .53 K/W when the condenser temperature was set to 20°C and 30°C, respectively. When the PHP was tilted to 45° above horizontal the PHP had a resistance of .76 K/W and .59 K/W when the condenser was set 20°C and 30°C, respectively. The PHP greatly improves the heat transfer properties of the heat sink compared to the aluminum plate alone. Additional considerations regarding flat plate PHP design are also presented. |
| Sponsorship | Fluids Engineering Division |
| File Format | |
| ISBN | 9780791846278 |
| DOI | 10.1115/ICNMM2014-21233 |
| Volume Number | ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels |
| Conference Proceedings | ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting |
| Language | English |
| Publisher Date | 2014-08-03 |
| Publisher Place | Chicago, Illinois, USA |
| Access Restriction | Subscribed |
| Subject Keyword | Water Aluminum plate Temperature Flat plates Condensers (steam plant) Aluminum Electronic components Dimensions Heat flux Stress Thermal energy Design Fluids Thermal resistance Heat pipes Heat sinks Heat transfer |
| Content Type | Text |
| Resource Type | Article |
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