NDLI: Evaluation of Single Phase Flow in Microchannels for High Flux Chip Cooling: Thermohydraulic Performance Enhancement and Fabrication Technology

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Satish, G. Kandlikar William, J. Grande
Copyright Year	2004
Abstract	The increased circuit density on today’s computer chips is reaching the heat dissipation limits for air-cooled technology. Direct liquid cooling of chips is being considered as a viable alternative. This paper reviews liquid cooling in terms of technological options and challenges. The possibilities presented herein indicate a four-to ten-fold increase in heat flux over the air-cooled systems. The roadmap for single-phase cooling technology is presented to identify research opportunities in meeting the cooling demands of future IC chips. The use of three-dimensional microchannels that incorporate either microstructures in the channel of grooves in the channel surfaces may lead to enhancement in single-phase cooling. A simplified fabrication process is described that can build both classes of three-dimensional microchannels. Proof-of-concept microchannels are presented to demonstrate the efficacy of the fabrication process.
Sponsorship	Nanotechnology Institute
Starting Page	67
Ending Page	76
Page Count	10
File Format	PDF
ISBN	0791841642
DOI	10.1115/ICMM2004-2321
Volume Number	ASME 2nd International Conference on Microchannels and Minichannels
Conference Proceedings	ASME 2004 2nd International Conference on Microchannels and Minichannels
Language	English
Publisher Date	2004-06-17
Publisher Place	Rochester, New York, USA
Access Restriction	Subscribed
Subject Keyword	Integrated circuits Heat Cooling Circuits Energy dissipation Manufacturing Flow (dynamics) Density Heat flux Microchannels
Content Type	Text
Resource Type	Article

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