NDLI: Thermal Design and Optimization of Harsh Environment Power Electronics in Natural Convection Heat Transfer

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Arik, Mehmet Nagulapally, Manoj Brzozowski, Steven Glaser, John
Copyright Year	2003
Abstract	A study of thermal management of a harsh environment power electronics system is presented. The thermal environments were found to be between 65 °C and 90 °C that is considerably higher than many traditional electronics applications. A modular, low cost, and passive air-cooling system was desired. An analytical model was developed to obtain the heat transfer characteristics. Further performance verification of the thermal management solution was completed using a commercially available CFD tool. A small footprint area for thermal design of the power electronics connected with an electrically isolating low-conductivity material to the heat sink increased the challenge. A further thermal performance enhancement was achieved with the addition of a heat spreader between power electronics and the heat sink, and optimization of the heat spreader was achieved by utilizing FEM technique.
Sponsorship	Heat Transfer Division
Starting Page	379
Ending Page	387
Page Count	9
File Format	PDF
ISBN	0791836959
DOI	10.1115/HT2003-47015
e-ISBN	0791836797
Volume Number	Heat Transfer: Volume 3
Conference Proceedings	ASME 2003 Heat Transfer Summer Conference
Language	English
Publisher Date	2003-07-21
Publisher Place	Las Vegas, Nevada, USA
Access Restriction	Subscribed
Subject Keyword	Design Finite element technique Natural convection Power electronics Thermal spreader Thermal interface material Optimization Electronics Heat transfer
Content Type	Text
Resource Type	Article

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