NDLI: Effect of Material Properties and Thickness of Die Attach on Delamination of Die Attach/Die Paddle Interface in Electronic Package

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Chang, Chia-Lung Li, Po-Hsien
Copyright Year	2010
Abstract	The electronic package is a multi-layered structure that is consisted of several materials. Under the temperature loadings, the interfacial stresses between layered components are generated due to the CTE (coefficient of thermal expansion) mismatch between different materials. In die bonding process, the void or defect might exist at the die attach/die paddle interface. The void cause further delamination on the interface during the encapsulation process. In this study, the finite element method is used to construct the model of electronic package with a void on the die attach/die paddle interface. The energy release rate based on J integration, which is calculated by the stress and strain around the tip of crack, is used as a damage parameter to predict the tendency of further delamination during encapsulation. Effect of material properties (Young’s modulus and CTE) and die attach thickness on delamination of die attach/die paddle interface in package during encapsulation is studied.
Sponsorship	International
Starting Page	95
Ending Page	101
Page Count	7
File Format	PDF
ISBN	9780791849187
DOI	10.1115/ESDA2010-24516
e-ISBN	9780791838778
Volume Number	ASME 2010 10th Biennial Conference on Engineering Systems Design and Analysis, Volume 4
Conference Proceedings	ASME 2010 10th Biennial Conference on Engineering Systems Design and Analysis
Language	English
Publisher Date	2010-07-12
Publisher Place	Istanbul, Turkey
Access Restriction	Subscribed
Subject Keyword	Energy release rate Delamination Die attach Finite element Electronic packages Materials properties
Content Type	Text
Resource Type	Article

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