NDLI: Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Ming-Hwa R. Jen Lee-Cheng Liu Jenq-Dah Wu
Copyright Year	2005
Abstract	The work is aimed to investigate the mechanical responses of bare dies of the combination of pure tin∕Al–NiV–Cu Under bump metallization (UBM) and packages of pure tin∕Al–NiV–Cu UBM/substrate of standard thickness of aurum. The mechanical properties under multiple reflow and long term high temperature storage test (HTST) tests at different temperatures and the operational life were obtained. A scanning electron microscope was used to observe the growth of IMC and the failure modes in order to realize their reaction and connection. From the empirical results of bare dies, the delamination between IMC and die was observed due to the tests at 260 °C multiple reflow. However, their mechanical properties were not affected. Nevertheless, the bump shear strength of bare dies were decreased by HTST tests. In package, all the results of mechanical properties by multiple reflow test and HTST test were significantly lowered. It was shown that the adhesion between bump and die reduced obviously as tests going on. As for high temperature operational life test in the conditions of 150 °C and 320 mA (5040A∕cm2), the average stable service time of the package was 892 h, and the average ultimate service time of the package was 1053 h.
Starting Page	446
Ending Page	451
Page Count	6
File Format	PDF
ISSN	10437398
e-ISSN	15289044
Journal	Journal of Electronic Packaging
Volume Number	127
Issue Number	4
DOI	10.1115/1.2070090
Language	English
Publisher	The American Society of Mechanical Engineers
Publisher Date	2005-01-13
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Ball-Grid-Array packaging Delamination Failure Flip-chip High temperature Lead-free solders Life testing Mechanical properties Optical microscopes Reliability Scanning electron microscopes Shear (Mechanics) Shear strength Solders Storage Temperature Thickness
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering Computer Science Applications Mechanics of Materials Electronic, Optical and Magnetic Materials

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