NDLI: Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Anderson, Ann M.
Copyright Year	1994
Abstract	In many heat transfer situations, such as those found in the electronics cooling field, more than a single mode of heat transfer occurs. For example, modules on a printed circuit board dissipate heat through convection to the air, through conduction to the board and through radiation to the surroundings. The adiabatic heat transfer coefficient, had , works well in such situations because it describes the change in wall temperature due to each incremental change in the convective heat transfer rate (due to conduction, radiation, or generation in the wall). The value of had is independent of the surface heat transfer distribution and can be used with the superposition method to interface between a convection solver and a conduction solver and “decouple” a conjugate heat transfer problem. If one uses the heat transfer coefficient based on the mean fluid temperature, hm , the problem is complicated because the value of hm is a function of the surface heat transfer distribution. This decoupling strategy is demonstrated through a series of numerical computations which solve the fully conjugate problem for laminar flow in a duct. These results are then compared to the decoupled solution. Excellent agreement between the fully conjugate and the decoupled solution is found for all cases when had and Tad are used to decouple the problem. Using hm and Tm can result in temperature prediction errors as large as 50 percent (for the cases studied here). The results show that when the Biot number (formulated as the resistance to axial wall conduction over the resistance to convection) is greater than 1.0 the adiabatic heat transfer coefficient should be used to decouple the problem. If the Biot number is below this value, h based on the mean temperature (for uniform surface temperature) can be used as the decoupler.
Starting Page	310
Ending Page	316
Page Count	7
File Format	PDF
ISSN	10437398
e-ISSN	15289044
Journal	Journal of Electronic Packaging
Volume Number	116
Issue Number	4
DOI	10.1115/1.2905703
Language	English
Publisher	The American Society of Mechanical Engineers
Publisher Date	1994-12-01
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Computation Computer cooling Convection Ducts Electrical resistance Errors Fluids Heat Heat conduction Heat transfer Heat transfer coefficients Laminar flow Printed circuit boards Radiation (Physics) Temperature Wall temperature
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering Computer Science Applications Mechanics of Materials Electronic, Optical and Magnetic Materials

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Effects of Substrate Conductivity on Convective Cooling of Electronic Components

Influence of Coolant Jet Pulsation on the Convective Film Cooling of an Adiabatic Wall

Improved Hybrid Solution of Conjugate Heat Transfer of Laminar Convection in Ducts With Axial Wall Conduction

Finite Element Predictions of Free Convection Heat Transfer Coefficients of Simulated Electronic Circuit Boards

Interaction of Heat Transfer by Conduction, Convection, and Radiation in a Radiating Fluid

Coupling of Convective and Radiative Heat Transfer in PV Cooling Ducts

Optimization of Finned Ducts in Laminar Flow

Combined Conduction, Natural Convection, and Radiation Heat Transfer in an Electronic Chassis

Heat Transfer for Laminar Flow in Ducts With Arbitrary Time Variations in Wall Temperature

Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient

Similar Documents

Effects of Substrate Conductivity on Convective Cooling of Electronic Components

Influence of Coolant Jet Pulsation on the Convective Film Cooling of an Adiabatic Wall

Improved Hybrid Solution of Conjugate Heat Transfer of Laminar Convection in Ducts With Axial Wall Conduction

Finite Element Predictions of Free Convection Heat Transfer Coefficients of Simulated Electronic Circuit Boards

Interaction of Heat Transfer by Conduction, Convection, and Radiation in a Radiating Fluid

Coupling of Convective and Radiative Heat Transfer in PV Cooling Ducts

Optimization of Finned Ducts in Laminar Flow

Combined Conduction, Natural Convection, and Radiation Heat Transfer in an Electronic Chassis

Heat Transfer for Laminar Flow in Ducts With Arbitrary Time Variations in Wall Temperature

Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient