NDLI: Electromigration for microarchitects

Content Provider	ACM Digital Library
Author	Abella, Jaume Vera, Xavier
Copyright Year	2010
Abstract	Degradation of devices has become a major issue for processor design due to continuous device shrinkage and current density increase. Transistors and wires suffer high stress, and failures may appear in the field. In particular, wires degrade mainly due to electromigration when driving current. Techniques to mitigate electromigration to some extent have been proposed from the circuit point of view, but much effort is still required from the microarchitecture side to enable wire scaling in future technologies. This survey brings to the microarchitecture community a comprehensive study of the causes and implications of electromigration in digital circuits and describes the challenges that must be faced to mitigate electromigration by means of microarchitectural solutions.
Starting Page	1
Ending Page	18
Page Count	18
File Format	PDF
ISSN	03600300
e-ISSN	15577341
DOI	10.1145/1667062.1667066
Journal	ACM Computing Surveys (CSUR)
Volume Number	42
Issue Number	2
Language	English
Publisher	Association for Computing Machinery (ACM)
Publisher Date	2010-03-05
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Electromigration Buses Degradation Wires
Content Type	Text
Resource Type	Article
Subject	Theoretical Computer Science Computer Science

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Electromigration for microarchitects