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2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits

2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Future of Nano-CMOS Technology and Its Production

Non-Volatile Memory Technology-Today and Tomorrow

A Review of New Characterization Methodologies of Gate Dielectric Breakdown and Negative Bias Temperature Instability

A novel empirical model for NBTI recovery with the modulated measurement time frame

Twin-GD: A New Twin Gated-Diode Measurement for the Interface Characterization of Ultra-Thin Gate Oxide MOSFET's with EOT Down to 1nm

Impact of Random Bit Values on NBTI Lifetime of an SRAM Cell

Gate-Oxide Reliability on CMOS Analog Amplifiers in a 130-nm Low-Voltage CMOS Processes

The Scanning Confocal Electron Microscope: A New Tool for Defect Studies in Semiconductor Devices

A Spectroscopic SEM: First Results

Using Probing Techniques to Identify and Study High Leakage Issues in the Development of 90nm Process and Below

A Study of Asymmetrical Behaviour in Advanced Nano SRAM Devices

Development of FIB-based Charge Reduction Methods for Auger Electron Spectroscopy and Their Application in Failure Analysis

The rules of the Rue Morgue: a decade later

Non-Classical Hot-Electron Gate Current in the Deep Submicrometer N-MOS Flash Memory Cell

Hot-Carrier Reliability of NLDEMOS in 0.13μm SOI CMOS Technology

Trapped Charge Distribution during the P/E Cycling of SONOS Memory

Local Strained Channel (LSC) nMOSFETs by Different Poly-Si Gate and SiN Capping Layer Thicknesses: Mobility Enhancement, Size Dependence, and Hot Carrier Stress

Electroluminescence spectroscopy for reliability investigations of 1.55μm bulk semiconductor optical amplifier

Diffractive lenses for high resolution laser based failure analysis

Technology Reliability Qualification of a 65nm CMOS Cu/Low-k BEOL Interconnect

Low-k Dielectric Breakdown Improvement with Co(W,P) Cap Barrier

Reliability Improvement in Multi-level Cu/SiOC Low k Integration

Thermal Reliability of Cu/low $-κ(Black-Diamond^{TM},$ BD) Interconnects on Flexible Organic Substrate

Advanced Test Methodology and Strategies for Semiconductors

Backside Fault Isolation Technique in 0.13μm and 90nm Product Prototyping

Tiny Pitts are the Yield Major Killer Caused by Metal Contamination in Wet Bench Cleaning

Study on Potassium Contamination in SOI Wafer Fabrication Using Dynamic SIMS

The New Concept for Particle Remove in Wet Bench Cleaning

Simulation Study of Hot-electron Reliability in strained-Si n-MOSFETs

Ultra-Short-Channel Characteristics of Planar MOSFETs With Block Oxide

Effects of Annealing and Temperature on SGOI Fabrication Using Ge Condensation

Three-Dimensional Transient Interconnect Analysis With Regard to Mechanical Stress

Inductance Considerations of on-Chip Interconnections for Best Electrostatic Discharge Protection Performance

Abnormal ESD Damages Occur in Interface Circuits between Different Power Domains in ND-Mode MM ESD Stress

Reliability Failures in Small Optocoupling and DC/DC Converter Devices

Characterization of a Burn-in Failure Caused by a Defective Source Driver on TFT-LCD Panel

Understanding Protective Overcoat Damages: Failure Analysis to the Next Level

A Study of Center Field Stripe Yield Loss Mechanism

A Study of Sulphur Assisted Corrosion in Technologies with Copper Interconnects

Application of FIB Circuit Edit and Electrical Characterization in Failure Analysis for Invisible Defect Issues

The Quantitative Analysis Methodology of Charged Potential by Electron Beam Bombardment for Improving the Passive Voltage Contrast on Advanced Technology

Novel Sample Preparation Methodology on TIM Materials for TEM Microstructure Study

Application of EDS Technique for OSP Film Thickness Measurement

TEM application in the failure analysis of advanced 90 nm SOI-based IC devices

Alternate Conductive Atomic Force Microscope with Scanning Capacitance Microscope to Catch Hidden Defect

Characterization of Binding Energy of Al Hexafluoride [AlF6]3- in X-Ray Photoelectron Spectroscopy

TetraMax Diagnosis and Laker Software on Failure Analysis For ATPG/Scan Failures

Factorial Analysis of Chip-on-Metal WLCSP Technology with Fan-Out Capability

Impact of the PCB design on the crack risk of CSP assemblies subjected to temperature cycling and drop tests

Bond Pad Optimization for CMOS Imager with Chip Scale Package

Investigation of Temperature and Strain Rate Behavior of Lead-free Solder Sn96.5Ag3.5

Breakthroughs in the Analysis of Leakage Failures in PBGA Packages

Lead frame Hillock-Induced Silicon Crack

Localization of Electrical Shorts in Dies and Packages using Magnetic Microscopy and Lock-in-IR Thermography

Design for Reliability

Novel method for debug of electrostatic discharge protection in VLSI circuits

Optimizing pulsed OBIC technique for ESD defect localization

Analysis of Failure Mechanism on Gate-Silicided and Gate-Non-Silicided, Drain/Source Silicide-blocked ESD NMOSFETs in a 65nm Bulk CMOS Technology

Carbon Nanotube Interconnects in Electrical and Biological Systems

Standard Silicon CMOS Device uses for developing a Biological Sensor

Interface Characterization for Vertically Aligned Carbon Nanofibers for On-chip Interconnect Applications

Reliability of Ultra-thin Zirconium Dioxide (ZrO2) Films on Strained-Si

Fabrication of high Ge content SiGe layer on Si by Ge condensation technique

Modeling of the Leakage Current in Ultrathin La2O3 Films Using a Generalized Power Law Equation

100 nm Gate Length Pt-Germanosilicide Schottky S/D PMOSFET on SGOI substrate fabricated by novel condensation approach

Detectivity Optimization of InGaAs Photon Emission Microscope Systems

Dynamic Optical Techniques for IC Debug and Failure Analysis

DC-Coupled Laser Induced Detection System for Fault Localization in Microelectronic Failure Analysis

Distinction of Photo-Electric and Thermal Effects in a MOSFET by 1064 nm Laser Stimulation

Application of Atomic Force Probing on 90nm DRAM Cell Failure Analysis

Apply Difference Analysis to Nano-Probing Technique for Reasoning Erratic Defect out in Integrated Circuits

Effect of Wire Thickness on Electromigration and Stress Migration Lifetime of Cu

New Failure Analysis of Tungsten Plug Corrosion in Via Process

Simulation of Texture Development Caused Stress Build-Up in Electroplated Copper Lines

Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005.

Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743)

Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003

Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)

Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548)

Proceedings of the 1999 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.99TH8394)

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits

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