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Improved Lead Frame System
| Content Provider | The Lens |
|---|---|
| Description | L'invention concerne une bande de grille de connexion (500) ayant un métal de canal en dent de scie ondulé (504, 506), le métal de canal en dent de scie ondulé (510, 512) étant constitué d'une épaisseur partielle du métal de bande de grille de connexion. L'invention concerne également une bande de grille de connexion (500) ayant un métal de canal en dent de scie ondulé (504, 506), le métal de canal en dent de scie ondulé (510, 512) étant constitué d'une demi-épaisseur du métal de bande de grille de connexion. |
| Abstract | A lead frame strip (500) with corrugated saw street metal (504, 506), where the corrugated saw street metal (510, 512) is comprised of a partial thickness of the lead frame strip metal. A lead frame strip (500) with corrugated saw street metal (504, 506), where the corrugated saw street metal (510, 512) is comprised of a half thickness of the lead frame strip metal. |
| Related Links | https://www.lens.org/lens/patent/013-130-548-609-979/frontpage |
| Language | English |
| Publisher Date | 2017-10-26 |
| Access Restriction | Open |
| Alternative Title | Système Amélioré De Grille De Connexion |
| Content Type | Text |
| Resource Type | Patent |
| Date Applied | 2016-04-22 |
| Agent | Jeekai & Partners |
| Applicant | Texas Instruments Inc Texas Instruments Japan |
| Application No. | 2016079981 |
| Claim | A lead frame strip with corrugated saw streets comprised of corrugated metal where a portion of the corrugated saw streets are attached to a lead frame strip support tape. The lead frame strip of claim 1， further comprising a plurality of lead frames coupled to the corrugated saw streets by tie bars wherein a thickness of the lead frames are a full lead frame strip metal thickness and wherein a thickness of the corrugated metal and the tie bars are a partial lead frame strip metal thickness. The lead frame strip of claim 1， further comprising a plurality of lead frames coupled to the saw streets by tie bars wherein a thickness of the lead frames are a full lead frame strip metal thickness and wherein a thickness of the corrugated metal and the tie bars are a half lead frame strip metal thickness. The lead frame strip of claim 1， further comprising a plurality of lead frames coupled together with the corrugated saw streets. The lead frame strip of claim 4， wherein the lead frames contain one IC chip pad and contain a plurality of wirebond pads. The lead frame strip of claim 4， wherein the lead frames contain a plurality of wirebond pads and do not contain an IC chip pad. The lead frame strip of claim 5， wherein the IC chip pad and the plurality of wirebond pads are formed of full lead frame strip metal thickness and are attached to the lead frame strip support tape. The lead frame strip of claim 1， wherein the lead frame strip is composed of copper or a copper alloy. A lead frame strip， comprising： lead frame strip support tape； a plurality of corrugated saw streets comprised of corrugated metal with a partial thickness of the lead frame strip metal and where a first portion of the corrugated saw street is separated from the lead frame strip support tape by a void and where a second portion of the corrugated saw street is attached to the lead frame strip support tape. a plurality of lead frames coupled on all sides to corrugated saw streets； and a plurality of wirebond pads within each lead frame comprised of a full thickness of lead frame strip metal and attached to the lead frame strip support tape and coupled to the corrugated saw streets. The lead frame strip of claim 9， wherein the partial thickness of the Corrugated saw streets is 30％ to 60％ the thickness of the lead frame strip metal thickness. The lead frame strip of claim 9， wherein the partial thickness of the Corrugated saw streets is about half the thickness of the lead frame strip metal thickness. The lead frame strip of claim 9， further comprising an IC chip pad comprised of a full lead frame strip metal thickness and coupled to the corrugated saw streets and electrically isolated from the wirebond pads. The lead frame strip of claim 12， wherein the IC chip pad is coupled to the corrugated saw streets with tie bars where the tie bars are comprised of a partial thickness of lead frame strip meta The lead frame strip of claim 9， further comprising tie bars with a partial thickness of the lead frame strip metal and wherein the tie bars couple the wirebond pads to the corrugated saw streets. The lead frame strip of claim 9， wherein the lead frame strip is comprised of copper or a copper alloy. |
| CPC Classification | Semiconductor Devices Not Covered By Class H10 |
| Extended Family | 092-665-613-136-52X 013-130-548-609-979 085-587-658-668-445 192-428-291-854-17X 178-009-759-220-76X |
| Patent ID | 2017181399 |
| Inventor/Author | Ma Minhui Hu Qinghua Chin-sern Alex Ting Rolda Jr Ruben D Deng Xingliang |
| IPC | H01L23/495 |
| Status | Pending |
| Simple Family | 092-665-613-136-52X 013-130-548-609-979 085-587-658-668-445 192-428-291-854-17X 178-009-759-220-76X |
| CPC (with Group) | H01L23/49548 H01L21/6836 H01L23/49541 H01L23/49565 H01L2224/48247 H01L2224/48464 H01L2224/49171 H01L2224/73265 H01L2224/97 H01L23/4951 H01L23/4952 H01L23/49579 H01L23/544 H01L2223/54453 |
| Issuing Authority | United States Patent and Trademark Office (USPTO) |
| Kind | Patent Application Publication |
