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Transfer Film for In-mold Molding, Method for Producing In-mold Molded Product, and Molded Product
| Content Provider | The Lens |
|---|---|
| Abstract | The transfer film for in-mold molding of the invention has transfer layer 11 being a transfer layer to be transferred onto a transfer object in in-mold molding and cured by irradiation with an active energy ray after being transferred; and film-like base L0. Transfer layer 11 has topcoat layer L2 laminated on base L0 to be arranged on a surface of a molded product after in-mold molding; and conductor layer L4 laminated on a side opposite to a base L0 side of topcoat layer L2, and laminated on topcoat layer L2. Topcoat layer L2 is composed of a mixed composition containing an active energy ray-curable resin and a thermosetting resin, and conductor layer L4 is formed of at least one kind selected from the group of a flexible metal, carbon and conductive polymer. |
| Related Links | https://www.lens.org/lens/patent/011-311-470-532-122/frontpage |
| Language | English |
| Publisher Date | 2019-10-22 |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Patent |
| Jurisdiction | United States of America |
| Date Applied | 2013-12-02 |
| Agent | Jciprnet |
| Applicant | Jnc Corp |
| Application No. | 201314652790 |
| Claim | A transfer film for in-mold molding, comprising: a transfer layer to be transferred onto a transfer object in in-mold molding, and being cured by irradiation with an active energy ray after being transferred; and a film base, wherein the transfer layer has a topcoat layer laminated on the film base to be arranged on a surface of a molded product after in-mold molding; and a conductor layer laminated on a first side of the topcoat layer opposite to a second side of the topcoat layer facing the film base, the transfer layer has an anchor layer that is between the topcoat layer and the conductor layer, and directly laminated on the topcoat layer, and contains a thermosetting resin having been thermally cured to improve adhesion between the topcoat layer and the conductor layer, the topcoat layer comprises a mixed composition containing an active energy ray-curable resin and a thermosetting resin, the conductor layer is formed of at least one kind selected from the group of a flexible metal, carbon and conductive polymer, and the thermosetting resin contained in the anchor layer is identical with the thermosetting resin contained in the mixed composition comprised in the topcoat layer. The transfer film for in-mold molding according to claim 1 , wherein the transfer layer includes the thermosetting resin contained in the topcoat layer in which the thermosetting resin is cured by heating before transfer. The transfer film for in-mold molding according to claim 1 , wherein the thermosetting resin contains at least one kind of an epoxy resin, a melamine resin and a urethane resin. The transfer film for in-mold molding according to claim 1 , wherein the topcoat layer contains a surface modification component or has a surface modification layer at the second side of the topcoat layer facing the film base. The transfer film for in-mold molding according to claim 4 , wherein the surface modification component or the surface modification layer contains at least one kind selected from a silicone compound, a fluorine compound and a fluorosilsesquioxane-containing compound. The transfer film for in-mold molding according to claim 1 , wherein the transfer layer further has a printing layer laminated on the anchor layer or the conductor layer. The transfer film for in-mold molding according to claim 1 , wherein the transfer layer further has an adhesive layer to be adhered on a resin for in-mold molding to be injected in the in mold molding a mold. A method for producing an in-mold molded product, comprising; a step of placing and arranging on a mold the transfer film for in-mold molding according to claim 1 such that the side of the film base is arranged on a side of the mold; and a step of injecting a resin for in-mold molding onto the transfer film for in-mold molding. A molded product, comprising: a transfer layer of the transfer film for in-mold molding according to claim 1 ; and a transfer object onto which the transfer layer is transferred. |
| CPC Classification | SHAPING OR JOINING OF PLASTICS;SHAPING OF MATERIAL IN A PLASTIC STATE; NOT OTHERWISE PROVIDED FOR;AFTER-TREATMENT OF THE SHAPED PRODUCTS; e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B; B29C OR B29D; RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR LAYERED PRODUCTS; i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT; e.g. CELLULAR OR HONEYCOMB; FORM COATING COMPOSITIONS; e.g. PAINTS; VARNISHES OR LACQUERS;FILLING PASTES;CHEMICAL PAINT OR INK REMOVERS;INKS;CORRECTING FLUIDS;WOODSTAINS;PASTES OR SOLIDS FOR COLOURING OR PRINTING;USE OF MATERIALS THEREFOR |
| Examiner | Anish P Desai |
| Extended Family | 173-372-826-033-564 068-419-916-848-635 039-089-917-901-425 011-311-470-532-122 194-297-492-488-28X 074-434-878-142-107 045-412-945-788-890 030-685-965-990-323 197-284-760-508-440 150-925-546-316-028 |
| Patent ID | 10449705 |
| Inventor/Author | Ito Kenya Ohguma Koji |
| IPC | B29C45/16 B29C45/14 B29K101/10 B32B7/02 B32B15/08 B32B27/08 B32B27/36 B32B27/38 B32B27/40 B32B27/42 B32B37/02 B32B37/26 C09D1/00 |
| Status | Inactive |
| Owner | Jnc Corporation |
| Simple Family | 173-372-826-033-564 068-419-916-848-635 039-089-917-901-425 011-311-470-532-122 194-297-492-488-28X 074-434-878-142-107 045-412-945-788-890 030-685-965-990-323 197-284-760-508-440 150-925-546-316-028 |
| CPC (with Group) | B29C45/14016 B29C45/1418 B29C45/14827 B29K2995/0005 B32B15/08 B32B27/08 B32B27/36 B32B27/38 B32B27/40 B32B27/42 B32B37/02 B32B2037/268 B32B2255/10 B32B2255/28 B32B2307/202 B32B2307/306 B32B2307/412 B32B2307/558 B32B2307/714 B32B2307/734 B32B2307/748 B32B2310/0831 B32B2571/00 C09D1/00 B29C45/1679 B29K2101/10 B32B2262/103 B32B2398/10 |
| Issuing Authority | United States Patent and Trademark Office (USPTO) |
| Kind | Patent/New European patent specification (amended specification after opposition procedure) |