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Method of Bonding A Plurality of Bonded Members
| Content Provider | The Lens |
|---|---|
| Related Links | https://www.lens.org/lens/patent/010-729-365-374-275/frontpage |
| Language | English |
| Publisher Date | 2019-02-27 |
| Access Restriction | Open |
| Alternative Title | Verfahren Zum Verbinden Mehrerer Vebindungselemente Methode D'assemblage De Plusieurs Membres A Assembler |
| Content Type | Text |
| Resource Type | Patent |
| Date Applied | 2011-05-13 |
| Agent | Müller-boré & Partner Patentanwälte Partg Mbb |
| Applicant | Dowa Electronics Materials Co Ltd |
| Application No. | 11842826 |
| Claim | A method of bonding a plurality of bonded members, comprising the steps in the following order: coating a bonding surface of a first bonded member with a bonding material; and characterised by the following steps in the following order: applying auxiliary calcination to the first bonded member coated with the bonding material, by heating it to a prescribed temperature; setting a second bonded member on a layer of the bonding material with which the heated first bonded member is coated; and applying full calcination to the first bonded member on which the second bonded member is set, by applying heat treatment thereto to a higher temperature than the temperature of the auxiliary calcination, to thereby form a bonding layer between the first bonded member and the second bonded member. The method according to claim 1, wherein the bonding material contains an organic material having two or more carboxyl groups. The method according to claim 1 or 2, wherein the bonding material contains silver nanoparticles with an average primary particle size of at least 1 nm or more and 200 nm or less. The method according to any one of claims 1 to 3, wherein in performing the full calcination, pressurization of 20 MPa or less is added onto bonding surfaces of the first bonded member and the second bonded member. The method according to any one of claims 1 to 4, wherein the bonding material contains silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1 nm or more and 200 nm or less, silver particles having an average particle size of 0.5 µm or more and 10 µm or less, an organic material having two or more carboxyl groups, and a dispersion medium. The method according to any one of claims 1 to 5, wherein the full calcination is performed in an inert gas atmosphere. The method according to any one of claims 1 to 6, wherein the full calcination is performed at a temperature of 150°C or more and 500°C or less. The method according to any one of claims 1 to 7, wherein a rate of heating temperature rise is set to 0.1°C/second or more and 2.0°C/second or less in the full calcination. |
| CPC Classification | SOLDERING OR UNSOLDERING;WELDING;CLADDING OR PLATING BY SOLDERING OR WELDING;CUTTING BY APPLYING HEAT LOCALLY; e.g. FLAME CUTTING;WORKING BY LASER BEAM Semiconductor Devices Not Covered By Class H10 WORKING METALLIC POWDER;MANUFACTURE OF ARTICLES FROM METALLIC POWDER;MAKING METALLIC POWDER ;APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER SPEECH ANALYSIS TECHNIQUES OR SPEECH SYNTHESIS;SPEECH RECOGNITION;SPEECH OR VOICE PROCESSING TECHNIQUES;SPEECH OR AUDIO CODING OR DECODING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION LAYERED PRODUCTS; i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT; e.g. CELLULAR OR HONEYCOMB; FORM |
| Extended Family | 186-043-481-001-165 136-568-502-168-107 139-716-380-099-895 164-196-498-767-270 114-980-294-160-245 095-028-451-385-415 087-515-909-197-191 107-823-859-631-401 064-591-642-961-153 091-879-726-072-726 108-371-624-595-786 062-443-845-095-112 114-265-233-676-982 174-034-961-155-358 195-453-662-785-139 152-182-926-491-790 173-915-783-226-638 010-729-365-374-275 |
| Patent ID | 2645408 |
| Inventor/Author | Kurita Satoru Endoh Keiichi Saito Yu Hisaeda Yutaka Ueyama Toshihiko |
| IPC | H01L21/60 B22F1/052 B22F1/102 B22F1/148 B23K1/00 B23K20/00 B23K35/02 B23K101/36 B32B3/26 B32B15/01 H01L23/00 H05K3/32 |
| Status | Active |
| Simple Family | 186-043-481-001-165 136-568-502-168-107 139-716-380-099-895 164-196-498-767-270 114-980-294-160-245 095-028-451-385-415 087-515-909-197-191 107-823-859-631-401 064-591-642-961-153 091-879-726-072-726 108-371-624-595-786 062-443-845-095-112 114-265-233-676-982 174-034-961-155-358 195-453-662-785-139 152-182-926-491-790 173-915-783-226-638 010-729-365-374-275 |
| CPC (with Group) | B23K1/0016 B23K20/00 H01L24/29 H01L24/32 H01L24/83 H01L2224/2929 H01L2224/29339 H01L2224/2939 H01L2224/2949 H01L2224/83075 H01L2224/83204 H01L2224/83801 H01L2224/83907 H01L2224/83986 H01L2924/01047 H01L2924/01006 H01L2924/01029 H01L2924/13091 H01L2924/13055 B22F2999/00 H01L2924/10253 H01L2224/83192 H01L24/05 H01L24/27 H01L2224/04026 H01L2224/05639 H01L2224/2732 H01L2224/27505 H01L2224/32225 H01L2224/83439 H01L2224/8384 H01L2224/27318 H01L2224/29294 H01L2924/1306 H01L2924/1301 H01L2924/13033 H01L2924/1305 H01L2924/15747 H01L2924/203 H01L2924/12042 G10L2019/0002 G10L2019/0011 Y10T428/12479 B23K2101/36 B23K35/025 B32B15/018 B22F1/052 B22F1/102 B22F1/148 H01L2224/27848 B23K31/02 B32B3/26 H01L21/64 |
| Issuing Authority | United States Patent and Trademark Office (USPTO) |
| Kind | Patent/Patent 1st level of publication/Inventor's certificate |
