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Dmd Assembly, Dlp Optical Engine and Dlp Projection Device
| Content Provider | The Lens |
|---|---|
| Abstract | The present disclosure relates to the field of optical and projecting technology, and particularly to a DMD assembly, DLP optical engine and DLP projection device. The DMD assembly includes a base, a driver board, a chip substrate with a DMD chip and a fixing frame, where a first side of the base is provided with a mounting groove for mounting the chip substrate, a second side of the base is attached to the driver board, and the first side is opposite to the second side; a conductive spring leaf on the base extends through a bottom of the mounting groove and is beyond the second side, so that the chip substrate is electrically connected to the driver board through the conductive spring leaf; the driver board is provided with a first through hole, and the fixing frame is provided with a second through hole; position of the first hole corresponds to position of the second hole, and the driver board and the fixing frame are fixed by a fastener extending through the first through hole and the second through hole; and the fixing frame is provided with an inserting hole, into which the base is inserted. |
| Related Links | https://www.lens.org/lens/patent/010-530-592-822-367/frontpage |
| Language | English |
| Publisher Date | 2017-09-07 |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Patent |
| Jurisdiction | United States of America |
| Date Applied | 2017-05-22 |
| Applicant | Hisense Co Ltd |
| Application No. | 201715600950 |
| Claim | A DMD assembly, comprising a base, a driver board, a chip substrate with a DMD chip and a fixing frame, wherein a first side of the base is provided with a mounting groove configured to mount the chip substrate, a second side of the base is attached to the driver board, and the first side is opposite to the second side; the base is provided with conductive spring leaves which extend through a bottom of the mounting groove and are beyond the second side, so that the chip substrate is electrically connected to the driver board through the conductive spring leaves; the driver board is provided with a first through hole, and the fixing frame is provided with a second through hole; position of the first through hole corresponds to position of the second through hole, and the driver board and the fixing frame are fixed together by a fastener extending through the first through hole and the second through hole; and the fixing frame is provided with an inserting hole, into which the base is inserted. The DMD assembly according to claim 1 , wherein an elastic protrusion is provided around the inserting hole on a side of the fixing frame away from the driver board; the elastic protrusion comprises a fixing portion connected to the fixing frame and a pressing portion on the fixing portion; a surface of the pressing portion facing the chip substrate contacts the chip substrate, so as to clamp the chip substrate against the base, and a surface of the pressing portion facing the mounting groove's side wall contacts the mounting groove's side wall, so as to cooperate with the inserting hole to confine position of the base. The DMD assembly according to claim 2 , wherein the fixing portion comprises a supporting portion perpendicular to the fixing frame and a turning portion on the supporting portion, wherein the turning portion extends to the inserting hole, and the pressing portion is on a side of the turning portion facing the driver board. The DMD assembly according to claim 2 , wherein the elastic protrusion is integrally molded with the fixing frame. The DMD assembly according to claim 2 , wherein there is an interference contact between a surface of the pressing portion facing the chip substrate and a surface of the chip substrate. The DMD assembly according to claim 1 , wherein the DMD assembly further comprises a mounting plate, and the mounting plate is provided with a third through hole, whose position corresponds to the position of the first through hole; and the fastener fixes the mounting plate to a side of the driver board away from the fixing frame through the third through hole. The DMD assembly according to claim 6 , wherein a first locating column is provided on a side of the mounting plate where the mounting plate is attached to the driver board; the driver board is provided with a first locating hole, and the first locating hole matches the first locating column. The DMD assembly according to claim 1 , wherein the second side is provided with a second locating column, the driver board is provided with a second locating hole, and the second locating hole matches the second locating column. The DMD assembly according to claim 1 , wherein a side wall of the mounting groove is provided with an elastic stopper, and the elastic stopper abuts an edge of the chip substrate so as to confine position of the chip substrate. The DMD assembly according to claim 1 , wherein the DMD assembly further comprises a mounting plate and a heat sink; wherein the mounting plate is provided on a side of the driver board away from the base, and the heat sink comprises a cooling block which protrudes from an end face of the heat sink; the heat sink is attached to the mounting plate on the end face; each of the driver board, the mounting plate and the base is provided with a penetrating hole through which the cooling block goes, and the penetrating hole corresponds to a side of the chip substrate facing the driver board; the cooling block goes through the penetrating holes on the mounting plate, the driver board and the base to be attached to a side of the DMD chip facing the driver board. The DMD assembly according to claim 10 , wherein the cooling block is attached to the side of the chip substrate facing the driver board through a heat-conducting ge The DMD assembly according to claim 10 , wherein the end face is provided with a third locating column, and the mounting plate is provided with a third locating hole matching the third locating column. The DMD assembly according to claim 10 , wherein the DMD assembly further comprises a heat sink connection plate and a first screw, a spring is fitted to the first screw, the end face is provided with a fourth through hole matching the spring, and each of the mounting plate and the driver board are provided with a fifth through hole matching the first screw; the heat sink connection plate is provided with a first convex column with interior thread; one end of the spring abuts a nut of the first screw, and the other end of the spring abuts the mounting plate through the fourth through hole on the end face; the first screw connects to a thread of the first convex column via the fourth through hole on the end face, the fifth through hole on the mounting plate and the fifth through hole on the driver board, and the fixing frame locates between the driver board and the heat sink connection plate. The DMD assembly according to claim 13 , wherein the heat sink connection plate is provided with an inserting dowel, and one edge of the chip substrate is provided with an inserting slot engaging with and matching the inserting dowe The DMD assembly according to claim 10 , wherein the DMD assembly further comprises a heat sink connection plate and a second screw; a spring and a spring leaf are fitted to the second screw; the end face is provided with a six through hole matching the spring; each of the mounting plate and the driver board is provided with a seventh through hole matching the second screw; the heat sink connection plate is provided with a second convex column with interior thread; a first end of the spring leaf abuts a nut of the second screw, a second end of the spring leaf abuts a surface area of the end face facing the nut of the second screw, the first end of the spring leaf locates between the nut of the second screw and a first end of the spring, and the other end of the spring abuts the mounting plate through the sixth through hole on the end face; the second screw connects to a thread of the second convex column through the six through hole on the end face, the seventh through hole on the mounting plate and the seventh hole through on the driver board, and the fixing frame locates between the driver board and the heat sink connection plate. The DMD assembly according to claim 15 , wherein the heat sink connection board is provided with an inserting dowel, and one edge of the chip substrate is provided with an inserting slot matching and engaging with the inserting dowe The DMD assembly according to claim 1 , wherein the DMD assembly further comprises a heat sink, the heat sink comprises a cooling block and the cooling block protrudes from an end face of the heat sink, wherein the heat sink is attached to the driver board on the end face; each of the driver board and the base is provided with a penetrating hole through which the cooling block goes, and the penetrating hole corresponds to a side of the chip substrate facing the driver board; the cooling block extends through the penetrating holes on the driver board and the base to be attached to the side of the DMD chip facing the driver board. A DLP projection device, comprising a DMD assembly, wherein the DMD assembly comprises a base, a driver board, a chip substrate with a DMD chip, and a fixing frame, a first side of the base is provided with a mounting groove for mounting the chip substrate, a second side of the base is attached to the driver board and the first side is opposite to the second side; the base is provided with a conductive spring leaf, which extends through a bottom of the mounting groove and is beyond the second side, so that the chip substrate is electrically connected to the driver board through the conductive spring leaf; the driver board is provided with a first through hole, and the fixing frame is provided with a second through hole; position of the first through hole corresponds to position of the second through hole, and the driver board and the fixing frame are fixed by a fastener extending through the first through hole and the second through hole; and the fixing frame is provided with an inserting hole, into which the base is inserted. The projection device according to claim 18 , wherein the DMD assembly further comprises a heat sink, the heat sink comprises a cooling block and the cooling block protrudes from an end face of the heat sink, wherein the heat sink is attached to the driver board on the end face; each of the driver board and the base is provided with a penetrating hole through which the cooling block goes, and the penetrating hole correspond to a side of the chip substrate facing the driver board; the cooling block extends through the penetrating hole on the driver board and the penetrating hole on the base to be attached to the side of the DMD chip facing the driver board. The projection device according to claim 18 , wherein the DMD assembly further comprises a mounting plate and a heat sink, the mounting plate is provided on a side of the driver board away from the base, and the heat sink comprises a cooling block, which protrudes from an end face on the heat sink, wherein the heat sink is attached to the mounting plate on the end face; each of the driver board, the mounting plate and the base is provided with a penetrating hole through which the cooling block goes, and the penetrating hole corresponds to a side of the chip substrate facing the driver board; the cooling block goes through the penetrating hole on the mounting plate, the penetrating hole on the driver board and the penetrating hole on the base to be attached to a side of the DMD chip facing the driver board. |
| CPC Classification | OPTICAL ELEMENTS; SYSTEMS OR APPARATUS APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM;APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES;ACCESSORIES THEREFOR PICTORIAL COMMUNICATION; e.g. TELEVISION Semiconductor Devices Not Covered By Class H10 |
| Extended Family | 008-432-048-800-577 113-416-802-497-458 068-367-221-795-862 060-649-627-275-175 101-926-572-308-600 027-094-813-184-16X 010-530-592-822-367 |
| Patent ID | 20170255006 |
| Inventor/Author | Hou Naiwen Tian Xintuan Yang Changming |
| IPC | G02B26/08 G02B7/00 G03B21/00 G03B21/14 H04N9/31 |
| Status | Active |
| Owner | Hisense Co. Ltd Hisense Laser Display Co. Ltd |
| Simple Family | 060-649-627-275-175 068-367-221-795-862 113-416-802-497-458 010-530-592-822-367 |
| CPC (with Group) | G02B26/0833 G02B7/181 G03B21/008 G03B21/145 G03B21/16 H04N9/3102 G02B7/003 H01L23/4006 H01L2023/405 H01L2023/4056 H01L2023/4081 H01L2023/4087 H04N9/3114 H04N9/315 |
| Issuing Authority | United States Patent and Trademark Office (USPTO) |
| Kind | Patent Application Publication |
